Packaging and Die Attach
Optoelectronic, laser diode mounting and electronic packaging
Camera Module Packaging
Sealants for CMOS, CCD, and Wafer Level Optics Packaging
Nano- and micro-replication layers for information storage and display applications
Wafer-level-optic lens, plastic lens, hybrid lens
OLED/PLED Edge seal, chip and sensors packaging
Plastic to plastic, plastic to glass, or plastic to metal laminating adhesives
High performance resins for a range of applications
Addison Clear Wave provides epoxy- and acrylate-based heat- and UV-curable adhesives and sealants with a wide range of properties for diverse applications in the optics, optoelectronics, flat panel display, semiconductor and consumer electronics industries. ACW adhesives, sealants and coatings are used for encapsulation of CMOS and electronic components, optoelectronics and die attach integrated circuit packaging, flat panel display sealing, CCD lens bonding, camera module assembly, plastic and glass hard coating and lamination, optical fiber cladding and coating, and many other demanding applications.
Unique properties of ACW’s adhesives and sealants include dual-cure resins that cure with either UV radiation or heat for applications with shaded areas, high Tg UV curable sealants for semiconductor or component packaging, UV-Snap Cure adhesives that are stable at room temperature but cure at temperatures as low as 60-70 °C after UV activation, high refractive index resins for Wafer-Level-Optic lens fabrication in mobile phone and display applications, low refractive index adhesives and materials for cladding and optoelectronics applications, UV photopolymer (2P) resins for nano or micro imprinting with either metal or plastic masters, thermally conductive adhesives, and flame-retardant optical fiber coatings.
Addison Clear Wave features custom design of resins for specific needs. Our R&D group works closely with customers to develop new products rapidly. Contact us if you would like to fine tune one of our products for a new application or if you are in the design stage of your new product.
Recent Blog Posts
Glass Beads in Your Adhesive for Precise Bondline Widths? ACW Can Help. READ MORE…
A1855-TX An Active Alignment Dual-Cure, Epoxy Only Adhesive with Deep UV Cure. READ MORE…
A Dual-Cure (UV or Heat) Epoxy Adhesive that Blocks UV, Visible, and Near IR Light. Wait, is that an oxymoron? READ MORE…
Optoelectronics Components that Live Forever? Can your components hold up for, oh, a millennium? READ MORE…
Flowing and non-flowing thermally conductive adhesives for semiconductor packaging READ MORE…
Low Temperature Dual Cure Epoxies for Active Alignment, Camera Modules, and Semi-Conductor Packaging
ACW offers a unique line of dual cure, UV and thermal cure, for the most demanding adhesive applications including active alignment. These are epoxy only adhesives that offer robust reliability and high adhesion. Cure with either UV or heat at temperatures as low as 80 °C to obtain a high Tg epoxy. For more general information, see the Dual Cure write up in the Blog section. For a list of products, see the Dual Cure product page.
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ACW sends informational emails to those who sign up to receive them. These emails focus on ACW products, processes, or questions that we learn about. If you are interested in receiving these emails, please sign up at the following site: Email-Sign-Up
NEW! Antimony-free, UV-cure, epoxy adhesives
ACW is pleased to introduce two new antimony-free, UV-cure epoxy adhesives. For information, see the blog page Antimony-Free Epoxies.
Spectra of some of our cured films are now available on this website. See Data Sheets and Spectra.
CHOOSE YOUR APPLICATION:
- Semiconductor Packaging
- Optoelectronics Applications
- Camera Module Adhesives
- Wafer-Level Camera, High RI Optical Lens Resins
- Nano and Micro Photo Replication
- Edge Sealants for Display Panels and LCD Chips
- Laminating and Hardcoating of Plastic Substrates