Active Alignment Adhesives
Precision alignment for camera modules, sensors, optical components, optoelectronics
Silicon Photonics Packaging
Fiber to V-groove, fiber array to chip, wafer level bonding
Camera Module Packaging
Sealants for CMOS, CCD, and Wafer Level Optics Packaging
LiDAR Sensors Assembly
Lens bonding, packaging, active alignment, thermal conductive
Nano- and micro-replication layers for information storage and display applications
Wafer-level-optic lens, plastic lens, hybrid lens
Packaging and Die Attach
Optoelectronic, laser diode mounting and electronic packaging
LCD and OLED Sealing
LCD/OLED/PLED Edge seal, chip and sensors packaging
Hard Coats for Plastic or Glass, Laminating Adhesives
High performance resins for a range of applications
Addison Clear Wave provides epoxy- and acrylate-based heat- and UV-curable adhesives and sealants with a wide range of properties for diverse applications in the optics, optoelectronics, flat panel display, semiconductor and consumer electronics industries. ACW adhesives, sealants and coatings are used for encapsulation of CMOS and electronic components, optoelectronics and die attach integrated circuit packaging, flat panel display sealing, CCD lens bonding, camera module assembly, plastic and glass hard coating and lamination, optical fiber cladding and coating, and many other demanding applications.
Unique properties of ACW’s adhesives and sealants include dual-cure resins that cure with either UV radiation or heat for applications with shaded areas, high Tg UV curable sealants for semiconductor or component packaging, UV-Snap Cure adhesives that are stable at room temperature but cure at temperatures as low as 60-70 °C after UV activation, high refractive index resins for Wafer-Level-Optic lens fabrication in mobile phone and display applications, UV photopolymer (2P) resins and photo nanoimprint lithography (P-NIL) resins for either metal or plastic stampers, thermally conductive adhesives, and flame-retardant optical fiber coatings.
Addison Clear Wave features custom design of resins for specific needs. Our R&D group works closely with customers to develop new products rapidly. Contact us if you would like to fine tune one of our products for a new application or if you are in the design stage of your new product.
Recent Blog Posts
ACW Has Updated Its P-NIL Resins Brochures READ MORE
High Refractive Index (RI) Resins for Bright Diffractive Optical Elements (DOE) READ MORE
Non-Yellowing Photo Nano-Imprint Lithography (P-NIL) Resin for Diffractive Optical Element (DOE) READ MORE
HC-6000, ACW’s High Performance Colloidal Silica Hybrid Hard Coat – high hardness, low shrinkage, and superior scratch resistance READ MORE
TA101-S: Dual-Cure Adhesive; Soft, Compliant, Thermal Conductive Film READ MORE
Range of Viscosities of Dual-Cure Adhesives for Active Alignment READ MORE
High Performance Nano-Imprint Lithography Resin: BD-400 takes a lickin’ and..READ MORE
Photo Nano-Imprint Lithography (P-NIL) READ MORE…
Adding Spacer Beads in Your Adhesive for Precise Bondline Widths? ACW Can Help. READ MORE…
A1855-TX An Active Alignment Dual-Cure, Epoxy Only Adhesive with Deep UV Cure. READ MORE…
Low Temperature Dual Cure Epoxies for Active Alignment, Camera Modules, and Semi-Conductor Packaging
ACW offers a unique line of dual cure, UV and thermal cure, for the most demanding adhesive applications including active alignment. These are epoxy only adhesives that offer robust reliability and high adhesion. Cure with either UV or heat at temperatures as low as 80 °C to obtain a high Tg epoxy. For more general information, see the Dual Cure write up in the Blog section. For a list of products, see the Dual Cure product page.
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ACW sends informational emails to those who sign up to receive them. These emails focus on ACW products, processes, or questions that we learn about. If you are interested in receiving these emails, please sign up at the following site: Email-Sign-Up
Antimony-free, UV-cure, epoxy adhesives
When antimony is a concern, ACW has antimony-free, UV-cure epoxy adhesives. For information, see the blog page Antimony-Free Epoxies.
UV-visible-Near IR Spectra
CHOOSE YOUR APPLICATION:
- Semiconductor Packaging
- Optoelectronics Applications
- Active Alignment Adhesives
- Silicon Photonics Adhesives
- Camera Module Adhesives
- LiDAR Sensors Adhesives
- Wafer-Level Camera, High RI Optical Lens Resins
- Photo Nano-Imprint Lithography (P-NIL)
- Sealants for LCD and OLED Displays
- Hard Coats for Plastics or Glass, Laminating Adhesives