Silicon Photonics Adhesives

The goal of silicon photonics is to develop high-volume, low-cost optical components using silicon as an optical material with standard CMOS processing, the well-known manufacturing processes already used for microprocessors and semiconductor devices. Manufacturing silicon photonic components in high volume to the specifications needed by optical communications will be highly cost effective.

One of the most challenging tasks for silicon photonic components is packaging with excellent optical interphase for highly reliable performance through the lifetime of the components.  Silicon photonic packaging engineers need to balance performance, flexibility and feasibility for package designs.  ACW is poised to partner with engineers for successful design of complex packages that are reliable, low cost and scalable.  ACW provides a full range of UV and dual-cure adhesives that offer solutions to many bonding tasks from optically clear adhesives for bonding optical fiber to V-groove to thermal conductive dual cure adhesives for underfill.  ACW adhesives are low cost, high performance alternatives to laser welding or gold-tin soldering.

In the table below, all of the adhesives are 100% epoxy resins with the following features.
A, UV-cure;  B Dual-Cure;  C Fiber to V-groove;  D lid and lens bonding;  E chip packaging;  F active alignment; G High UV depth of cure;  H thermal conductive;  I underfill.

Epoxy Feature η (cps)*  TI**  Tg (°C)  Data
A535-AN A C D  4,000   –  170  TDS
A539-DM B C E  2,000   –  145  TDS
A1853-TX B F 65,000   7  165  TDS
A1855-TX B F G 65,000   7  180  TDS
A1708-TX B F 13,000   2  168  TDS
TCR-1003R1 B G H I 10,000   2  166  TDS

*Viscosity at 25 °C; for thixotropic resins, η is at 10 s-1 shear rate.
**Thixotropic Index = η at shear 1 s-1 / η at shear 10 s-1.

Follow the link below for a brochure describing silicon photonics adhesives.