Dual Cure Adhesives

ACW’s Dual Cure Epoxy Adhesives can be cured with UV light or heat.  These are single component resins that offer long working lives at room temperature.  These products are especially good for active alignment applications.  Use UV to set the alignment and heat to cure the adhesive in shaded areas.  Thixotropic versions are available.  Thermal conductive versions are boron nitride filled.  For more details about Dual Cure Epoxy adhesives, see the Dual Cure page in the Blog section.  For a quick reference to popular Dual Cure Epoxies for active alignment applications, see the Dual Cure Table.

dispense      mate          fix             cure

Applications:  glass to glass bonding, glass to ceramic bonding, glass to plastic bonding, semiconductor or optoelectronic packaging, component packaging, active alignment applications, and camera module assembly.

Product η (cps, 25 °C) Tg (°C) Applications   Data Sheets
Dual Cure (85 °C)
A1853 4,500 155 A, B, C, D, F, No Sb TDS
A1851-TX thixotropic, 11,000* 164 A, B, C, F, No Sb TDS
A1853-TX thixotropic, 70,000* 165 A, B, C, E, F, No Sb TDS
A1855-TX thixotropic, 65,000* 175-180 A, B, C, E, F, No Sb TDS
Dual Cure (90-100 °C)
A539-DM 1,900 – 2,200 145 A, B, C TDS
A1721-TX thixotropic, 12,000* 165 A, B, C, No Sb TDS
A1723-TX thixotropic, 9,000 165 A, B, C, No Sb TDS
TCL-202 thixotropic, 32,000* 183 A, B, E, F, G, No Sb TDS
TCL-203 thixotropic, 55,000* 181 A, B, E, F, G, No Sb TDS
CM-500 thixotropic, 65,000* 145 A, B, No Sb TDS
Dual Cure (110-130 °C)
TA 101-S 30,000 – 34,000 50  A, B, D, G, I, No Sb TDS
Dual Cure (130-150 °C)
A535-AT 1,200 – 1,500 160  A, B, C, D, E TDS
A1708-A 4,200 – 4,500 168  A, B, C, D, E TDS
A1708-TX thixotropic, 13,000* 178  A, B, C, D, E TDS
A1708-TX2 thixotropic, 50,000* 170  A, B, C, D, E TDS
A1710-TX2 thixotropic, 50,000* 170  A, B, C, noSb TDS
TCR-1002 thixotropic, 28,000* 160  A, B, E, G TDS
TCR-1003 thixotropic, 55,000* 166  A, B, E, G TDS

* Viscosity for thixotropic paste when measured at shear rate of 10/s.
A: Bonding
B: Semiconductor, CMOS bonding, chip & component packaging
C: Active alignment
D: Die-attach
E: Low outgas; meets MIL-STD 883/5011
F: Compatible with PC lenses and optical components in camera modules
G: Thermal conductive
H: High depth of UV cure
I:  Compliant, rubbery