News & Blog

News & Blog

BD-400: Automotive Tough P-NIL Resin

Photo-Nanoimprint Lithography (P-NIL or UV-NIL) is a versatile technique for low-cost nanoscale device fabrication with a wide range of applications.  As automobiles with increasing numbers of detectors evolve, opportunities for P-NIL fabricated lenses will increase.  But, for the automotive industry, P-NIL materials must survive extreme stress conditions required to demonstrate automobile efficacy.  BD-400, ACW’s premier Read More…

Nanoimprint Lithography Resins

UV or photo Nano-Imprint Lithography (UV-NIL or P-NIL) is a versatile technique for low-cost nanoscale device fabrication. The precise, direct patterning and repeatable replication of complex three-dimensional nanoscale patterns (submicron, 10’s of nanometers) in a single step make the NIL technique compelling in comparison to other expensive techniques such as e-beam or helium ion beam Read More…

Adding Spacer Beads in Your Adhesive for Precise Bondline Widths? ACW Can Help.

Feb 11, 2020.  A common method for obtaining precise bondline widths is to add spacer beads to an adhesive.  Unfortunately, if you are doing that yourself, you likely have not had many pleasant experiences.  ACW can eliminate the pain by adding the spacers for you. Spacer beads are a great way to give reproducible, precise Read More…

Flowing and Non-Flowing Thermally Conductive Epoxies

Thermally conductive epoxy adhesives are important in semiconductor packaging applications because they can provide both bonding strength and thermal conduction from the device to a thermal sink.  Thermally conductive epoxies are either electrically conductive, containing a metal filler, or electrically insulating, containing a ceramic filler. ACW offers thermally conductive electrically insulating dual cure epoxy adhesives Read More…

ACW’s UV-Snap Cure Epoxies

Are you assembling temperature-sensitive components with shaded regions?  If so, your choices of adhesives are limited.  For your demanding applications, ACW offers UV-Snap Cure epoxies, adhesives developed for optoelectronics, electronics and semi-conductor packaging where the parts are opaque or have shaded areas and the components are temperature sensitive. UV-Snaps are one-component epoxies that are room Read More…