Optoelectronics Applications
ACW offers a variety of adhesives for assembly of optoelectronics components including UV cure epoxies, Dual-Cure (UV and/or light) epoxies and acrylates, and high RI resins. Contact us with your questions.
Applications
• Fibers to V-Grooves
• Lens and mirror to housing or PCB
• Grin lens bonding
• Wafer-level packaging and bonding
• Glass to metal sealing
• Hermetic package sealing
• Waveguide devices bonding
See the Optoelectronics brochure:
UV-curable, high Tg Epoxy Adhesives for fiber array
| Product | Features | Data Sheet |
| A-535-A | viscosity 1,000 cps, Tg = 155 °C | TDS |
| A-535-AN | viscosity 3,500 cps, Tg = 170 °C | TDS |
| A535-E | viscsity 700 cps, Tg = 137 °C | TDS |
| A-535-AF | viscosity 3,500 cps, Tg = 130 °C | TDS |
See the FAU bonding brochure for more information.
High RI Optical Bonding Adhesive
| Product | Features | Data Sheet |
| L2007 | high RI (1.567), Tg = 109 °C, excellent optical clarity, high power laser applications | TDS |
Dual Cure Optical Component Packaging
| Product | Features | Data Sheet |
| M625-B | acrylate, viscosity 14,000 cps, cure at 90-120 °C | TDS |
| M730-L | acrylate, viscosity 800 cps, cure at 75-85 °C | TDS |
| A539-DM | epoxy, viscosity 2,000 cps, cure at 100-120 °C | TDS |
| A535-AT | epoxy, viscosity 1,200 cps, cure at 125-180 °C | TDS |
See the Dual Cure Adhesives Brochure for more information.
Do you need a custom designed resin?