Photo Stamp Resins for Nanoimprint Lithography
ACW offers photo-curable resins for the production of multi-use working stamps from a master mold. Resins for both hard stamps with rigid backings and soft stamps with flexible backings are available. The working stamps provide low production cost and high accuracy approaches to nanoimprint lithography.
FS-200, while flexible, can be used for hard stamps. It is an acrylate with a modulus similar to that of polycarbonate. FS-300 is also an acrylate, with a reasonably high modulus. Both FS-200 and FS-300 give strong but highly flexible films. They have high Tg and are much stronger than PDMS but are highly flexible as well as optically clear.
To download the ACW NIL Stamps brochure, click HERE.
| Product | η (cps, 25 °C) | Tg (°C) | Modulus* (MPa) | Data Sheets |
| FS-200 | 400-500 | 133 | 1,700 | TDS |
| FS-300 | 300-400 | 122 | 1,200 | TDS |
| PC (ref)# | 140 | 2,000 | ||
| PDMS (ref)# | -125 | 2 |
* Young’s modulus (elastic modulus) at 25 °C.
# Literature reference values for PC (polycarbonate) and PDMS (polydimethylsilicone).