Photo Nanoimprint Lithography Resins for Diffractive Optical Elements (DOE)

ACW has a range of photopolymer resins for micro- and nano-replications, photo nanoimprint lithography (P-NIL), and UV-embossing to create embossed features on plastic, glass, silicon, or metal substrates.  The applications include information layer for data storage, light directing features for display films, diffractive optical elements (DOE), and nanometer features on silicon chips.  The cured photopolymer resins have high hardness, high Tg, and dimensional stability under normal operating temperatures.  The resins provide ultra-accurate replicated features from stampers or molds at micrometer to 10’s of nanometer scales.  The uncured resins have low viscosity and are suitable for spin coating.  The RI of IP-158 matches that of PC, and the RI of BD-319 matches that of PMMA.

The high RI of IP-158 and PR-1600-CA result in a high brightness films.  The most recent addition to the ACW high RI P-NIL stable is PR-1612, which has an RI at 489 nm of 1.612.  All of the high RI P-NIL resins are optically clear in the visible.

Product η (cps, 25 °C) Tg (°C) RI (d)* Data Sheets
IP-158 420-500   70 1.584   TDS
BD-218 380-420 120 1.506   TDS
BD-319 500-600   62 1.491   TDS
BD-400 1,200-1,700 139 1.510   TDS
PR-1600-CA 350-450   89 1.600   TDS
PR-1612 1,650-1,800   60 1.612   TDS

*RI of cured resin measured at 589 nm at 25 °C.

To open a PDF describing ACW’s P-NIL Resins, click on the image.