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Products and Data
Sheets
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Metal TO Can Packaging
AC M620
dual-cure,
cures with UV light and/or heat, metal laser diode TO
Can adhesive
Ultem TO Can Packaging
AC M620
dual-cure, cures with UV light
and/or heat
AC A410,
AC A420,
AC A619
UV-visible light curing
adhesives
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Fiber
Array to Chip Bonding
UV-curable, low RI,
optically clear, suitable for optical path applications, available
in dual-cure grades
AC R262-Mod5
high Tg, low viscosity, high
adhesion, suitable for polymer waveguide bonding
AC R260-A1
low viscosity, high adhesion
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AC A535,
AC A535-AN
UV-curable epoxy, optically
clear, high Tg, low CTE, suitable for optical path applications
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AC M617,
AC M625-B
dual-cure,
cures with UV light and/or heat, low shrinkage, low CTE, low outgas, high Tg, suitable for mounting diode chips to ceramic or metal
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AC A115-E
UV-curable, low stress,
excellent flow behavior, very low wavelength shift on curing
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MEMS, Isolator, Collimator, Optical Switch
AC M729-L,
AC M622-L,
AC M617-L,
AC M620-L
low temperature dual-cure,
UV and/or heat, excellent sealing, low moisture/gas permeability, low stress, good adhesion.
Use for opaque substrates including Kovar and ceramic
AC A535,
AC A535-AN,
AC A586
high Tg, low CTE, suitable for glass packaging
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AC A535,
AC A535-AN
medium viscosity, high Tg,
optically clear, for bonding GRIN lens to filter, including DWDM
AC A550 and
AC M620
flexible adhesive, for bonding GRIN lens to filter, including DWDM
AC R296
low temperature UV-curable, low RI, low viscosity, excellent flow behavior, optically clear, flexible adhesive for bonding polymer filter for optical components
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Optical Fiber
Cladding
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UV-curable low refractive index materials for cladding glass or plastic
optical fiber; high hardness, excellent chemical resistance, fast cure, easy
processing in draw tower applications.
AC R220-B
flexible cladding compound for
optical fiber coatings
AC R221
hard cladding compound for optical fiber coating
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Flame Retardant
Optical Fiber Coating
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Rigid display sealants
AC A1430-B
high viscosity, epoxy
sealant
AC A1428
medium viscosity, epoxy
sealant
AC A1432
high viscosity, fast curing epoxy sealant
Flexible display sealants
AC A1428
medium viscosity, plastic
to glass
AC A1429-F1
medium viscosity, plastic
to plastic
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AC A1800
UV-curable dot spacer and
insulation material, screen-printable
AC AP1740
UV-curable pressure
sensitive adhesive, screen-printable
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Lens Bonding and Optical Sheet
Applications
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UV-curable, optically clear adhesives, suitable for glass,
plastic and CCD lenses
AC A115-E
flexible adhesive
AC A535,
AC A535-AN
high Tg, high hardness,
polishable
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High
Refractive Index Lens Materials
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Prism Sheet and Brightness
Enhancement Film Resins
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AC PR-153, AC PR-155, AC PR-157
UV-curable, high RI, low viscosity, high
transparency, excellent adhesion to primed plastic substrates and glass.
These materials are suitable for prism sheet and brightness enhancement
film applications.
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Anti-Reflection Film
Applications
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UV-curable coatings, optically clear
high RI and low RI
materials for anti-reflection
coating in film
applications. Excellent wetting and excellent adhesion on many surfaces including coated
surfaces
LE-139UV-A5
RI = 1.39 at 589 nm, solution in MEK
MC166-IPA-60
RI = 1.66 at 589 nm, solution in IPA
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Hard Coat For Plastics
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AC HC-5619
Organic UV-curable coating, solvent based, high hardness hard coating for plastic
panels and films
AC HC-5302
Anti-static hard coat, UV-curable coating, solvent based,
high hardness hard coat for optical film applications
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Life Science Applications
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AC
A109-P
Low modulus, low stress, low
extractables adhesive for bonding plastic substrates (including
polystyrene, polypropylene, PVDF, PVPF) and glass. Suitable for
microplate assembly
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Laminating Adhesives for Plastic
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AC A109-P
UV-curable adhesive, fast cure rate, optically clear, low viscosity, excellent adhesion to plastics,
low extractables in water, adhesive for micro-well plate bonding
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Electronics Encapsulation and
Packaging
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AC A535,
AC A535-AN
UV-curable, high Tg, medium
viscosity, low shrinkage, optically clear, high temperature resistance
AC A550
UV-curable, optically clear,
flexible, high viscosity
AC M420-L,
AC M620-L
Low temperature, dual-cure (UV and thermal) products
for electronics encapsulation packaging. Use UV to fix the aligned
parts and heat to cure fully in shaded regions. These grades cure
thermally at temperatures as low as 80 °C.
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Semiconductor
Packaging
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CMOS packaging
AC A1428-T,
AC A1438,
AC A1437
UV-curable, high Tg, high temperature resistance, CMOS packaging to bond
glass to epoxy or ceramic dam. Good adhesion to BT, FR5, and ceramic substrates.
Fast curing minimizes lid pop-up. The three grades cover a wide range of
viscosities. AC A1438 (high viscosity) and AC A1437 (medium
viscosity) are suitable for bonding the glass lid to Ceramic Leadless Chip
Carrier (CLCC) or Organic Leadless Chip Carrier (OLCC). These
materials are compatible with solder reflow temperatures up to 280
°C and meet JDEC Level 3 reliability standards.
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Lens barrel to holder in CMOS image sensor
AC M729-L
Low-temperature, dual-cure
adhesive suitable for bonding lens barrel to plastic holder in a camera
lens module assembly. Use UV to fix the lens barrel with proper alignment,
and use heat to cure the adhesive in the shaded region between the barrel
and lens holder. Both grades cure thermally at 80
°C making them ideal for heat-sensitive plastic holders.
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DLP Projection Display
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AC
M60-7
DLP adhesive, dual-cure, high Tg, high
adhesion strength, excellent thermal cycling properties for use in
light-pipes and color-wheel applications
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Special Bonding Problems
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ACW
is a
leader in custom
design of resins with specific RI, viscosity, and thermal stability requirements.
Contact our R&D team at:
Info@AddisonCW.com.
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