Semiconductor and optoelectronics packaging

Optoelectronics and semiconductor packaging, UV-curable epoxy-based sealants, high Tg, polish-able, solder reflow compatible UV-curable sealants for chips and components packaging, suitable for active alignment applications.

Semiconductor packaging

Chip packaging, CMOS image sensor packaging, active alignment, suitable for syringe dispensing or jet-dispensing, long shelf life and pot life at room temperature.
AC A1432

High viscosity, clear sealant

AC A1432-SY

Thixotropic, yellow for vision alignment system detection

AC A1449

Dual cure, high viscosity, yellow color for vision detection, high Tg

Optoelectronics packaging

Fiber/V-groove bonding, components bonding, chip packaging.
AC A535-AN

Tg = 175 degree C

AC A535-A

Tg = 155 degree C

AC A586

Tg = 110 degree C

MSDS

MSDS

MSDS: A535 series, A1432 series, A1449, A586